Skip to main content
Sister Publication Links
  • Middle East Foam & Polyurethane
  • UTECH Asia/PU China
  • UTECH Europe
  • UTECH Las Americas
Subscribe
  • My Account
  • Login
  • Subscribe
  • Ukraine
  • News
    • Asia
    • Americas
    • Europe
    • M & A
    • Financial results
    • Automotive
  • Data
  • Information
    • Country Overview
    • Market Sector overviews
    • Technical articles
    • Company profiles and strategies
  • Events
    • Exhibitions
    • Conferences
    • Webinars / Livestreams
    • Become a Speaker
    • UTECH Europe 2021
  • Advertise
  • Contact Us
  • Issues
  • Subscribe
MENU
Breadcrumb
  1. Home
  2. News
October 21, 2010 12:00 AM

Polyurethane polishing pads for semiconductor makers

Utech Staff
  • Tweet
  • Share
  • Share
  • Email
  • More
    Print

    Aurora, Illinois - Cabot Microelectronics Corp has developed a key thermoplastic polyurethane technology which allows the continuous manufacturing of the polishing pads used in the production of wafers of semiconductor products.

    The firm, which says it is the world's leading supplier of chemical mechanical planarisation (CMP) polishing slurries and growing CMP pad supplier to the semiconductor industry, has introduced three CMP polishing pads from its Epic D100 platform that are intended to address customers' specific needs in the polishing process. Thy are the result of extensive research and development by Cabot Microelectronics, the firm pointed out in a 20 Oct announcement.

    A key benefit is that they can be made using a continuous process which, Cabot says, has attracted many customers due to its unique design that successfully reduces pad-to-pad variation. At the elevated temperatures encountered in the CMP process, thermoplastic polyurethane polymers are softer than conventional thermoset polymers, the firm says.

    This characteristic of thermoplastic polyurethane polymers has a direct impact on customers' polishing performance as it helps minimise microscratches on customers' wafers, resulting in lower defect rates for these expensive items.

    They also offer extremely short break-in times (i.e. the time needed to reach steady state performance) and customers have validated three times longer pad life compared to conventional pads, Cabot claims.

    "We have expanded the Epic product portfolio to respond to specific customer needs and to deliver best-in-class performance for a range of CMP polishing applications," said Dinesh Khanna, Cabot Microelectronics' global business director for CMP Pads.

    "We believe our new pad products offer customers unmatched quality, performance and optimal cost of ownership," his statement concluded.

    Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, is the world's leading supplier of CMP polishing slurries and growing CMP pad supplier to the semiconductor industry. The company's products play a critical role in the production of advanced semiconductor devices, enabling the manufacture of smaller, faster and more complex devices by its customers.

    "

    Recommended for You
    US government backs 3D printing initiative
    US government backs 3D printing initiative
    henkel adhesive recyclable packaging 800
    Henkel adds adhesives for recyclable food packaging
    formlabs 3dp pu resin 800
    Formlabs adds PU 3D printing resins
    Latest Issue
    April/May 2022 issue
    Click HERE for Free Download
    View All Archives
    Get our newsletters

    Breaking news and in-depth coverage of essential topics delivered straight to your inbox.

    Subscribe today

    Register to access our archive of leading information on the polyurethanes industry.

    Subscribe now
    Connect with Us
    • Twitter
    • LinkedIn
    • Facebook
    • Youtube

    Follow us on social media for the latest polyurethanes industry news and event updates.

    Logo
    Contact Us

    Office 127,
    61, Willow Walk,
    London
    SE1 5SF
    E-mail us
    +44 (0) 203 287 5979

    Customer Service:
    +1 313 446 0450

    Resources
    • Advertise with Us
    • Media Kit
    • Staff
    • Careers
    • Ad Choices Ad Choices
    • Sitemap
    Legal
    • Terms and Conditions
    • Privacy Policy
    • Privacy Request
    Copyright © 1996-2022. Crain Communications, Inc. All Rights Reserved.
    • Ukraine
    • News
      • Asia
      • Americas
      • Europe
      • M & A
      • Financial results
      • Automotive
    • Data
    • Information
      • Country Overview
      • Market Sector overviews
      • Technical articles
      • Company profiles and strategies
    • Events
      • Exhibitions
      • Conferences
      • Webinars / Livestreams
      • Become a Speaker
      • UTECH Europe 2021
    • Advertise
    • Contact Us
    • Issues
    • Subscribe