RAMP extends RIM's reach

By David Reed, UT EditorEnglewood, Colorado-CardXX, a US reaction injection moulder, has developed a process for encapsulating electronic components at precise locations within an elastomeric urethane matrix. Designated RAMP, for reaction-assisted moulding process, the low-temperature process is suitable for making smart cards, key fobs, and other portable electronic devices, claims Gusmer I Decker, in a 17 Aug statement.The RAMP technique precisely positions computer chips or other electronic components including batteries between two sheets of PVC (polyvinyl chloride) or polycarbonate film within a mould. Then a polyurethane mixture is injected at low temperature and low pressure to completely immerse the electronic elements. After curing is completed-in less than an hour says the Gusmer I Decker note-the components are securely encapsulated and protected.CardXX is currently using the technique to integrate a radio frequency identification chip and antennae, an integrated circuit, and other electronic components including batteries into small mouldings.The firm is now offering the patented technology through a licensing agreement , with the equipment required for the process to be provided by CardXX and Gusmer I Decker, the recently created polyurethane processing equipment entity following Graco Inc.'s takeover of the two previously independent businesses.Further details are available from: [email protected]"