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July 27, 2010 12:00 AM

Rampf to present PU adhesive at Bondexpo

Utech Staff
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    Grafenberg, Germany -- Rampf Giessharze is presenting its one-component polyurethane adhesive for the first time at Bondexpo 2010, held from 13 to 16 Sep 2010 at the Stuttgart New Exhibition Centre fairground, Stuttgart, Germany.

    Designated Raku-PUR 49-2452, the adhesive cures at over 85 degC, offers high strength, good weather- and moisture-resistance and has "extremely good filling and flow properties," a 26 July company statement said. In addition it can be dyed in different colours and is odour neutral, the firm added.

    Rampf Dosiertechnik, sister company and specialist in dispensing technology, will also present what it claims is an ideal low-pressure system for material application -- complete with integrated induction heating.

    "Normally, adhesives require high temperatures for curing. Our material reacts at an induction temperature of as low as 85 degC," Peter Gräter, head of development at Rampf Giessharze, said in the statement.

    Gräter said the stable bond created allows further processing within 30 to 60 seconds, depending on the component, explaining that this offers maximum possible flexibility for the production process.

    "Tests have shown that even after over three years, the material can still be processed with induction," he said. The new material from the polyurethane, epoxy and silicone specialist is particularly suited for bonding metal window and door frames, the statement added. (RD)

    PIC: Rampf demonstrates induction heating. Image courtesy of Hüttinger Elektronic GmbH & Co. KG.

    "

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